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We’re seeing occasional cracked solder joints in a small electronic assembly that warms up and cools down during normal use. The failures aren’t appearing immediately, which makes me wonder whether repeated temperature changes are stressing the joint over time.
For people who work with manufacturing or reliability testing, what would you check first: the board layout, solder alloy, component choice, or the temperature range itself? I’m also interested in how teams reproduce this kind of failure without confusing it with vibration or handling damage.
