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Commercial chip output from key semiconductor fabs in Dholera and Sanand is slated to begin by mid-2026. Backed by government subsidies, these foundries target mature nodes for automotive, power electronics, and IoT devices.
Current Progress in Packaging and Wafer Production
Assembly, testing, marking, and packaging units are entering trial runs, but full wafer fabrication requires reliable high-purity chemical suppliers and continuous clean power infrastructure.
- Node Focus: Initial focus on 28nm and legacy nodes rather than sub-5nm trailing edge.
- Ecosystem Readiness: Specialized chemical vendors and ultra-pure water treatment plants are still scaling.
Can domestic electronics manufacturers transition away from imported chips fast enough to absorb this new local capacity by late 2026?
